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Intel Strain Measurement Methodology for Circuit Board Assembly

Intel Strain Measurement Methodology for Circuit Board Assembly

Guide: Document provides overview of board flexure control methodology, board preparation, Intel(r) BFI metrics, component determinations, with motherboard assembly line strain measurement, flexure reductions, test planning, and general procedures.

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Guide: Document provides overview of board flexure control methodology, Intel(r) BFI metrics, with motherboard assembly line strain measurement.